Sanctions have strengthened Huawei. Not the opposite. That’s pretty insane when you think about it:...
TL;DR · AI 摘要
华为通过自主研发的τ缩放定律和LogicFolding架构实现技术突破，Kirin 9050 Pro芯片性能提升46%。
核心要点
- 华为采用τ缩放定律替代摩尔定律，晶体管密度提升55%
- Kirin 9050 Pro芯片在4个月内完成研发并量产
- LogicFolding架构通过垂直堆叠逻辑层实现性能飞跃
结构提纲
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- 华为技术突破
- τ缩放定律
- 替代摩尔定律
- 晶体管密度+55%
- LogicFolding架构
- 垂直堆叠逻辑层
- 性能提升46%
- Kirin 9050 Pro
- 4个月研发周期
- 行业领先创新速度
金句 / Highlights
值得收藏与分享的关键句。
Kirin芯片在四个月后发布，性能提升46%且晶体管密度增加55%
LogicFolding架构通过垂直堆叠逻辑层实现性能飞跃
τ缩放定律使华为突破EUV技术封锁实现自主发展
Paul Couvert on X: "Sanctions have strengthened Huawei. Not the opposite. That’s pretty insane when you think about it: > Huawei can't access EUV > They’re ditching Moore's Law for their own (τ) scaling law > A lot of people think that’s just marketing > Kirin chip is shipped just 4 months later…… / X
Paul Couvert
@itsPaulAi
Sanctions have strengthened Huawei. Not the opposite. That’s pretty insane when you think about it: > Huawei can't access EUV > They’re ditching Moore's Law for their own (τ) scaling law > A lot of people think that’s just marketing > Kirin chip is shipped just 4 months later… And it’s 46% more powerful than previous gen! That’s very very impressive. Transistor density jumps roughly 55% and this is the first chip based on the new LogicFolding architecture (rooted in the Tau scaling law/stacking logic layers vertically). The innovation pace is actually faster than ever. Not only that, but it keeps accelerating.
#Huawei
#LogicFolding
Huawei
@Huawei
Sep 7
Huawei unveils tri-fold Mate XT 2 with Kirin 9050 Pro, the world's first chip with LogicFolding architecture. Executive Director, Chairman of the Investment Review Board & Chairman of the Board of Directors of the Consumer BG, Huawei, Mr. Yu Chengdong shared the chip's strengths.
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3:02 PM · Sep 8, 2026
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